Intel shows off their new chips while giving updates on their next release, Penryn, due out in November.
Taken from AppleInsider.com
Describing other advanced Intel technologies destined to quickly come to market, Otellini showed the world’s first 300mm wafer built using next-generation 32nm process technology. The development of advanced test chips serves as a critical milestone in the company’s march toward high-volume manufacturing of 32nm process technology, which it plans for 2009.
Intel’s 32nm test chips incorporate logic and memory (static random access memory –SRAM) to house more than 1.9 billion transistors, Otellini said. The 32nm process also uses the company’s second-generation high-k and metal gate transistor technology.
This additional performance made possible by Intel’s push to drive chip design and manufacturing technology forward will not only be seen in computing, but will enable more true-to-life entertainment and realistic graphics capabilities. As a result, the company said it will be placing increased emphasis on using the power of its processors to enhance key technologies such as visual computing and graphics.
“Satisfying demand for ever-greater computer performance increases means we need to move rapidly to the next manufacturing technology.” said Otellini. “Intel engineers and researchers deserve a great deal of credit for setting the pace for the industry. As our advanced technology reaches consumers and businesses in the next couple of years the amount of computing power they’ll be able to harness will help them become even more productive, creative and innovative.”